LF PowerBasket

Can be used as press-fit version or for SMT assembly

LF PowerBasket Power Supply Terminals are lead-free, pluggable High Current Contacts from Würth Elektronik ICS. With these you can reduce the assembly effort for your service technicians or customers. Simply plug in, no screws, done.

LF PowerBasket Powerelements are available for the following manufacturing processes:

• Press-fit technology
• SMT assembly

Our LF PowerBasket SMD Powerelements can be processed in typical SMT lines and are soldered in convection ovens or with the steam phase system.

Due to the design of the contact blades, the insertion/extraction forces are significantly reduced compared to conventional systems. In combination with a position tolerance of up to 0.6 mm, several contacts can be used simultaneously. This opens up completely new applications, especially for board-to-board connections. A special contact alloy enables use at higher ambient temperatures with optimum current carrying capacity.

All LF PowerBasket Powerelements are RoHS & REACH compliant without time limited exemption.

Various maintenance-friendly application possibilities

• Board-to-board
• Wire-to-board
• Use of multiple contacts simultaneously
• Maintenance-friendly connections (plugging instead of screwing)
• Multiple pluggable
• Extended operating temperature range
• Phase connection

Simple and high-quality processing

LF PowerBasket High Current Contacts are available as press-fit variants as well as for SMT assembly.

In press-fit technology, the LF PowerBaskets are pressed into the printed circuit board and are not exposed to temperature stress. The manufacturing step simply fits into the process chain and is extremely cost-effective. Several Powerelements can be pressed in at the same time using the appropriate press-in tools.

In SMT assembly, the LF PowerBasket SMD Powerelements are soldered onto the printed circuit board and simply fit into the process chain of an SMT line. Due to the heat absorption by the mass of the components, separate tests must be carried out to determine the parameters.

Delivery on reel in ESD blister packaging is optionally available with a Kapton-Sticker.

Design of printed circuit boards

With the solid press-fit technology, the printed circuit boards must be designed in accordance with the Würth Elektronik ICS Press Fit specification. Particular attention must be paid to drill diameter and copper thickness. Due to the different layer thicknesses in Hot Air Levelling compared to chemical final surfaces, the final diameters are different.

In the case of SMT assembly, the printed circuit boards must be designed in accordance with IPC A 600 in the respective valid edition. Information on the footprints is available.

LF PowerBasket has a high current carrying capacity

The current carrying capacity must always be considered in the context of the overall system. In press-fit technology, the press-fit zone itself has an extremely low contact resistance of 100-200 μOhm . In SMT assembly, the contact resistance is only 250-350 μOhm.

Our measurements have shown both for press-fit technology and for SMT assembly that the limiting factor is usually to be found in the layout of the printed circuit board or the connection of external supply lines.

Qualification: Successful vibration test

LF PowerBasket SMD High Current Contacts have successfully passed the vibration test according to ISO 16750-3.