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One-piece Powerelements, THR design, flexibly configurable
High Current Contacts for THR Mounting
PowerOne THR (Through Hole Reflow) High Current Contacts are one-piece Powerelements specially designed for THR mounting to supply and distribute high currents on PCBs. They are RoHS & REACH compliant, flexibly configurable and in use in various designs. Depending on the the layout, currents of up to 250 amperes are possible.
PowerOne THR can be used in varied applications
- Board-to-board over 90° or packaging
- Wire-to-board screw connection of ring terminals
- Electromechanics such as hinges and case mounting, spacers
- Retainers/fastenings of switches, fuses, IGBTs
- Any combination of all these and much more
Simple processing by soldering in an SMT line
With PowerOne THR power elements from Würth Elektronik ICS, soldered pins can be realized on the SMT line. It is an alternative if no THT process is intended or if selective THT is to be avoided.
Because the THR technology is based on SMT technology, it fits easily into the process chain of an SMT line. In paste printing, the paste is printed into the plated-through holes, and the openings in the stencil roughly correspond to the solder pad. The pins are placed in the solder paste of the filled plated-through holes of the PCB. When passing through the solder oven, the paste is melted and the pins are soldered in the hole.
Delivery on reel in ESD blister packaging is optionally with a Kapton sticker, enables a fast and cost-effective assembly.
Circuit Board Design
The printed circuit boards should be designed according to IPC A 600 in the currently valid edition. Information on the footprints / pinouts can be requested from your Powerelement team.
Torques of PowerOne THR Powerelements
The torques indicated in the table are based on DIN 267 part 25. Different material combinations or different thread lengths of the connectors are not regarded here.
Torque values for brass
|Thread size||M 2.5||M 3||M 4||M 5||M 6|
Currents up to 250 amperes
The current carrying capacity must always be considered in the context of the overall system. Our measurements show that the limiting factor is usually to be found in the layout of the PCB or the connection of external leads.